Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: Gold alloy solder preforms
Edited by the Electronicstalk Editorial
Team on 24 May 2004
Gold alloy solder preforms find a niche
Indium Corp offers AuSn and AuGe specialty solder preforms in thicknesses below 0.001in.
Indium Corp offers AuSn and AuGe specialty solder preforms in thicknesses below 0.001in Gold-alloy solder preforms address several unique soldering needs: they contain no lead; they deliver higher tensile strengths than SnPb types; they have relatively high melting points, making them suitable materials in a step-soldering scheme; and the precise manufacturing process yields tight-tolerance solder preforms in all three dimensions
According to Indium's Director of Fabricated Solder Products, Ross Berntson: "The physical properties of gold-alloy solder preforms enable manufacturers to go beyond their usual capabilities".
"Indium's materials and applications expertise are a part of several manufacturing success stories".
"Indium's ultra-thin technology provides for even greater solder volume control".
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