Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: Indium3.1
Edited by the Electronicstalk Editorial
Team on 19 October 2004
Water-soluble lead-free paste set to
clean up
Indium3.1 is a water-soluble Pb-free solder paste with exceptional printing, ideal for fine-pitch applications.
Indium3.1 is a water-soluble Pb-free solder paste with exceptional printing, ideal for fine-pitch applications The unprecedented stencil life virtually eliminates solder paste waste
In addition, Indium3.1 exhibits excellent wetting under both air and nitrogen reflow atmosphere.
Any residue is easily cleaned with water.
The resultant solder joints are shiny and smooth, including those of ultra fine-pitch components.
Indium3.1 also features a wide reflow window, outstanding slump resistance, low voiding and low foaming.
Standard packaging for stencil printing applications is 500g jars and 700g cartridges.
In addition, Indium3.1 is backed up by Indium Corp's internationally experienced engineers who provide in-depth technical assistance and expert advice in solder properties.
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