Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 12 January 2005
Senior execs to host Pb-free courses at
APEX
Indium Corp VP of Technology, Ning-Cheng Lee and Senior Technologist, Ronald C Lasky will both be presenting courses on Pb-free electronic assembly at APEX in Anaheim, California in February.
Indium Corp VP of Technology, Ning-Cheng Lee, PhD and Senior Technologist, Ronald C Lasky, PhD, PE, will both be presenting courses on Pb-free electronic assembly at APEX in Anaheim, California in February Dr Lee will be presenting "Lead-free soldering - metallurgical fundamentals, reflow applications and challenges", on Monday 21st February 2005 from 0830 to 1630
This article was originally published on Electronicstalk on 14 Jan 2004 at 8.00am (UK)
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Dr Lee is a world-renown soldering expert and also has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives.
His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
His course will cover all the fundamental design considerations of Pb-free alloys, with emphasis on metallurgical properties analysis.
The performance of representative alloys on reflow soldering will be discussed, along with major challenges, with a focus on metallurgical causes.
Dr Lasky's topic is "Best practices in implementing lead-free assembly", and he will also be presenting on Monday 21st February from 0830 to 1630.
Dr Lasky, a holder of the prestigious SMTA Founder's Award, is a world-renown process expert and visiting professor at Dartmouth College.
He has over 20 years of experience in electronic and optoelectronic packaging and assembly.
His course will focus on all the "how tos" of implementing Pb-free.
It covers every issue, such as PCB finishes, components, alloys and SMT processes.
It also reviews several actual implementations of Pb-free processing and will conclude with a Pb-free implementation plan to be used by 1st July 2006.
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