Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 24 February 2005
Solder materials on show in Cambridge
Indium Corporation will exhibit at IMAPS MicroTech 2005 on 1st and 2nd March 2005.
Indium Corporation will exhibit at IMAPS MicroTech 2005 on 1st and 2nd March 2005 The show, which will take place at the Moller Conference Centre in Cambridge, England, features photonics, power packaging, flip-chip technology and packaging reliability
Indium's exhibit will focus on semiconductor, power semiconductor and specialty solder materials, including solder wire, solder preforms, tape and reel preforms, bumping pastes, TAC fluxes and underfills.
In addition, Indium will feature Pb-free solder alloys and solder applications, such as die attach, solder fortifications, package construction and SMT mixed technology.
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