Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 14 March 2005
Lee to explain lead-free concepts in
China
Indium Corp's Vice President of Technology, Dr Ning-Cheng Lee, will present two papers at the Nepcon China Technology Summit on 11th April 2005 in Shanghai, China.
Indium Corp's Vice President of Technology, Dr Ning-Cheng Lee, will present two papers at the Nepcon China Technology Summit on 11th April 2005 in Shanghai, China The first paper is titled "A model study of profiling for voiding control at lead-free reflow soldering"
This article was originally published on Electronicstalk on 14 Jan 2004 at 8.00am (UK)
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Research kit evaluates solder alternatives
Indium Corp has developed a comprehensive solder research kit.
It contains detailed information regarding: voiding mechanisms and their relation to flux outgassing; modelling of outgassing against heat input as a function of time and temperature; and control of voiding via profiling.
The second paper is titled "The transition to Pb-Free production: from iNEMI roadmap to production".
It includes detailed information on: Pb-free alloy selection assessment; Pb-free manufacturability assessment; and Pb-free supply chain management.
Dr Lee is a world-renown soldering expert who has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills and adhesives.
His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
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