Pb-free portfolio on show in China

Indium Corporation will exhibit at Nepcon Shanghai Electronics Manufacturing Technology China from 12th to 15th April 2005.

Indium Corporation will exhibit at Nepcon Shanghai Electronics Manufacturing Technology China from 12th to 15th April 2005.

Indium's exhibit will feature advanced technologies in Pb-free electronics assembly with cutting edge materials.

The offering will span a full range of PCB assembly materials, including solder pastes, wave solder fluxes, rework materials, and solder fabrications such as solder preforms, solder ribbon and wire, and solder spheres.

Indium will be exhibiting at Booth 2J16.

Experts will be readily available at the booth to answer questions on Pb-free assembly.

Technical papers, articles, and other information will also be available.

Nepcon Shanghai is the largest electronics manufacturing event in China and provides an opportunity for global equipment and material suppliers to reach out to electronics manufacturers in China, especially in Shanghai, where major electronics high-tech manufacturing companies are located.

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