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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: Lead-free PCB assembly materials
Edited by the Electronicstalk Editorial Team on 01 April 2005

Lead-free PCB assembly in Nuremberg

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Indium Corporation will exhibit advanced technology Pb-free PCB assembly materials at SMT/Hybrid/Packaging 2005 in Nuremberg.

Indium Corporation will exhibit advanced technology Pb-free PCB assembly materials, including solder pastes, wave solder fluxes, rework materials and solder fabrications at SMT/Hybrid/Packaging 2005 in Nuremberg, Germany on 19th and 20th April 2005 Indium's exhibit will feature advanced technology Pb-Free electronics assembly materials

The offering will span a full range of PCB assembly materials, including solder pastes, wave solder fluxes, rework materials, and solder fabrications such as solder preforms, solder ribbon and wire, and solder spheres.

Indium will be exhibiting in Hall 7, Booth 323, with its distributor, GPS Technologies.

Experts will be readily available at the booth to answer questions on Pb-free electronic assembly materials and processes.

Technical papers, articles, and other information will also be available.

The SMT/Hybrid/Packaging Conference is one of the most important platforms for information and networking in the field of microelectronics assembly in Europe.

Conference and tutorials offer a wide spectrum of solution-oriented presentations on the latest technologies as well as future developments within the electronics assembly industry.

The show features the industry's leading companies on system integration in micro electronics - modern production, electronic systems, design and development, components, PCB, packaging and basis materials, advanced Packaging, hybrids, soldering and more.

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