Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: Assembly materials for semiconductor packaging
Edited by the Electronicstalk Editorial
Team on 14 April 2005
Semiconductor packaging expertise in
Singapore
Indium Corporation will feature advanced assembly materials for semiconductor packaging at Semicon Singapore.
Indium Corporation will feature advanced assembly materials for semiconductor packaging at Semicon Singapore The exhibition, held from 4th to 6th May 2005, will be held at the Suntec International Convention and Exhibition Centre in Singapore
This article was originally published on Electronicstalk on 24 Mar 2005 at 8.00am (UK)
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Advanced assembly materials on show in Munich
Indium Corp will exhibit at Semicon Europa in Munich, Germany from 12th to 14th April 2005.
Indium Corporation will feature semiconductor assembly materials including: no-flow underfills, epoxy fluxes, interconnect fluxes and BGA bumping pastes.
Experts will be readily available at the booth to answer questions on semiconductor and Pb-free assembly materials.
In addition, technical papers, articles, and information on a full range of electronic assembly materials, including solder pastes, wave solder fluxes, rework materials, and solder fabrications, will also be available.
Indium Corporation will be located on Level 6, Exhibit 1203.
The semiconductor market in Singapore is on the rise and spending on semiconductor materials in Singapore is forecasted to grow to over $1billion in 2005.
Singapore is home to leading assembly and test manufacturing facilities and the Semicon event attracted just under 8000 visitors in 2004.
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