Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 27 May 2005
Paper presents fundamentals of lead-free
soldering
Dr Ning-Cheng Lee will present his paper on "Lead-free soldering - metallurgical fundamentals, failure modes and process optimisation" at the forthcoming ECTC and IPC Soldertec conferences.
Indium Corporation's VP of Technology, Dr Ning-Cheng Lee, is scheduled to present at two forthcoming conferences: Electronic Components and Technology Conference (ECTC) in Lake Buena Vista, Florida on 31st May 2005, and IPC Soldertec in Barcelona, Spain from 7th to 10th June 2005 Dr Lee will present "Lead-free soldering - metallurgical fundamentals, failure modes and process optimisation" at both ECTC and IPC Soldertec
This article was originally published on Electronicstalk on 14 Jan 2004 at 8.00am (UK)
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Pb-free soldering products on show at APEX
Indium Corp will be exhibiting a number of Pb-free soldering products at APEX on Booth 1347.
This topic focuses on: Pb-free solders and surface finish materials; factors affecting solder performance and solder joint reliability; and approaches for improving Pb-free performance.
Additionally, on 7th June at IPC Soldertec, Dr Lee will present a short paper called "A kinetic approach to profiling for voiding control in lead-free reflow soldering".
Dr Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives.
His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
In addition to the presentations, Indium Corporation will also exhibit at both conferences.
The exhibit at ECTC will feature semiconductor assembly materials including: no-flow underfills, epoxy fluxes, interconnect fluxes and BGA bumping pastes.
The exhibit at IPC Soldertec will focus on electronic assembly materials, such as solder paste, wave solder fluxes, rework materials and solder fabrications.
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