Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 20 June 2005
Semiconductor assembly materials on show
Indium Corporation will be exhibiting its newest products for the semiconductor and power semiconductor assembly industry at Semicon West on from 12th to 14th July 2005.
Indium Corporation will be exhibiting its newest products for the semiconductor and power semiconductor assembly industry at Semicon West on from 12th to 14th July 2005 at the Moscone Center in San Francisco, California Indium Corporation's exhibit will focus on semiconductor, power semiconductor and specialty solder materials, including the first reworkable Pb-free no-flow underfill
This article was originally published on Electronicstalk on 27 Jun 2006 at 8.00am (UK)
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Reliability programme featured at Semicon West
Indium Corporation will highlight its Reliability Programme at its exhibit at Semicon West from 10th to 14th July 2006 at the Moscone Center in San Francisco.
In addition, Indium will feature solder wire, solder preforms, tape and reel solder preforms, bumping pastes, and TAC fluxes.
Indium's exhibit will also include Pb-free solder alloys and solder applications, such as die-attach and SMT mixed technology.
Semicon West is the largest exposition in North America dedicated to showcasing the technologies that enable the design and manufacture of micro- and nano-scale electronics, including semiconductors, micro-electromechanical systems (MEMS), flat panel displays (FPDs) and related devices.
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