Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 05 September 2005
Applications engineering team expands
Indium Corporation has appointed three new applications engineers.
Indium Corporation has appointed three new applications engineers Jim Hisert is new to Indium Corporation
This article was originally published on Electronicstalk on 14 Jan 2004 at 8.00am (UK)
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He recently worked as a Mechanical Engineer at Fiber Instrument Sales in Oriskany, New York where he designed and patented a new fibre-optic sensor.
In his new role, he will focus on developing and supporting Indium's semiconductor assembly products.
Hisert has a degree in mechanical engineering from SUNY Institute of Technology.
Dan McCall started with Indium Corporation in 2004 as a Manufacturing Engineer.
He now joins the Technical Support Department as an Applications Engineer where he will provide technical support to customers for fabricated solder products.
He has a degree in mechanical engineering technologies from SUNY Institute of Technology.
Ed Briggs has been with Indium Corporation since 1990 and was most recently a Supervisor for Indium's solder paste flux production.
As an Applications Engineer, Briggs will be responsible for providing internal e-mail and telephone support.
He will also manage the prompt responses to enquiries submitted to the online knowledgebase on Indium's website.
Briggs has a degree in chemical technology from Mohawk Valley Community College.
All three will be located at Indium's corporate headquarters in Clinton, New York, USA.
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