Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 12 September 2005
Full lead-free range goes on show
Indium Corporation will be exhibiting its Pb-free suite of materials at the Assembly Technology Expo in Rosemont, Illinois, from 26th to 28th September 2005.
Indium Corporation will be exhibiting its Pb-free suite of materials at the Assembly Technology Expo in Rosemont, Illinois, from 26th to 28th September 2005 Indium's exhibit will feature advanced technologies in Pb-free electronics assembly with cutting edge materials, including Indium5.1, a Pb-free no-clean solder paste with industry leading "response-to-pause" printing, and NF260, the industry's first reworkable Pb-free no-flow underfill
In addition, Indium's exhibit will include a full range of PCB assembly materials, including solder pastes, wave solder fluxes, rework materials and solder fabrications, such as solder preforms, solder ribbon and wire, and solder spheres.
Indium will be exhibiting on Booth 5631.
Experts will be readily available at the booth to answer questions on Pb-free assembly.
Articles and information will also be available.
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