Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 24 October 2005
Pb-free suite on show in Munich
Indium Corporation will be exhibiting its suite of Pb-free electronics assembly materials for WEEE and RoHS compliance at Productronica in Munich, Germany on from 15th to 18th November 2005.
Indium Corporation will be exhibiting its suite of Pb-free electronics assembly materials for WEEE and RoHS compliance at Productronica in Munich, Germany on from 15th to 18th November 2005 Indium will be located on Booth A3-550, with a full range of Pb-free assembly materials, including the first reworkable Pb-free no-flow underfill (NF-260) and its newest no-clean solder paste (Indium5.1) with its industry leading response-to-pause printing
This article was originally published on Electronicstalk on 14 Jan 2004 at 8.00am (UK)
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In addition, Indium will also feature other Pb-free materials, such as water-wash solder pastes (Indium3.1), solder preforms in tape and reel packaging, wave solder flux for Pb-free mixed-technology, and rework and repair materials.
Indium's Pb-free suite of materials is backed by an award-winning research and development team and an experienced Pb-free implementation support centre offering process proven solutions and staffed with one of the largest SMTA-certified teams in the industry.
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