Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: NF260
Edited by the Electronicstalk Editorial
Team on 16 February 2006
No-flow underfill wins award at APEX
NF260 No-Flow underfill won the 2006 Vision Award at the APEX show in Anaheim, California.
Indium Corporation's NF260 No-Flow underfill has earned the 2006 Vision Award at the APEX show in Anaheim, California Sponsored by SMT Magazine, the Vision Award recognises innovativeness, cost effectiveness, speed/throughput improvements, quality contributions, ease of use, maintainability/repairability, and environmental responsibility
This article was originally published on Electronicstalk on 5 Dec 2005 at 8.00am (UK)
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Novel no-flow underfill wins technology award
Indium Corporation has received the Global Technology Award for its NF260 no-flow underfill.
No-flow underfill stars in Shanghai
NF260 no-flow underfill has been awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China.
This is the second award for Indium's NF260 No-Flow underfill, having previously won the Global Technology Award at Productronica in 2005.
NF260 is the world's first reworkable, air reflowable, Pb-free no-flow underfill.
This remarkable product delivers increased reliability one order of magnitude over the leading competitor and two orders of magnitude over not using an underfill.
It also provides cost savings and improved performance.
Designed for Pb-free assembly, NF260 is fully compatible with the SMT process and offers a wide process window to accommodate solder reflow and underfill curing.
The underfill curing is completed in one reflow pass and no post-cure is required.
NF260 reduces costs when compared with capillary flow underfills, and also achieves higher yields.
What sets this product apart is its impressive durability in thermal cycling (2500 cycles with no failures) and in thermal shock testing.
NF260 surpassed endurance expectations, with no failures after more than 450 drop tests.
Under similar conditions, unfilled soldered connections typically fail after fewer than 10 drops.
NF220 is available for SnPb applications.
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