Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 02 March 2006
Thermal reliability in the spotlight
Indium Corporation will present its thermal reliability technology programme at Semi-Therm in Dallas.
Indium Corporation will present its thermal reliability technology programme at Semi-Therm, the Semiconductor Thermal Measurement, Modelling and Management Symposium and Exposition, from 12th to 16th March 2006 at the Hotel Intercontinental, Dallas, Texas USA With the increasing demands for power and miniaturisation driving thermal management issues, Indium Corporation has developed a materials science programme that addresses thermal performance concerns caused by increased power and reduced component size for thermal reliability
This article was originally published on Electronicstalk on 14 Jan 2004 at 8.00am (UK)
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Research kit evaluates solder alternatives
Indium Corp has developed a comprehensive solder research kit.
This comprehensive program focuses on the products, services, and technologies to support a process engineer's goal of optimising finished goods reliability.
Products featured at the show will include: solder thermal interface materials for heat dissipation, and specialty solders and assemblies for hermetic package sealing, as well as die-attach solder and materials for MEMS, RF and photonics.
Indium's technologists and information will be available on Booth 52.
Indium's Director of Solder Products, Ross Berntson, will also be serving as the Chair of the Thermal Materials Developments II session.
Semi-Therm provides delegates the opportunity to view the latest equipment and services related to thermal management and measurement.
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