Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 10 March 2006
Device packaging expertise on show in
Scottsdale
Indium Corporation will exhibit on Booth 35 at the IMAPS International Conference and Exhibition on Device Packaging on from 20th to 23rd March 2006 in Scottsdale, Arizona.
Indium Corporation will exhibit on Booth 35 at the IMAPS International Conference and Exhibition on Device Packaging on from 20th to 23rd March 2006 in Scottsdale, Arizona The conference will feature keynote speakers, technical sessions, professional development courses, and a vendor exhibition and technology showcase
Indium's exhibit will focus on wafer and chip bumping, semiconductor packaging materials, and specialty solder and assemblies, including solder wire, solder preforms and solder paste.
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