Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 24 March 2006
Lead-free reliability in focus in
Shanghai
Indium Corporation will highlight its reliability programme at Nepcon Shanghai Electronics Manufacturing Technology China from 4th to 7th April 2006.
Indium Corporation will highlight its reliability programme at Nepcon Shanghai Electronics Manufacturing Technology China from 4th to 7th April 2006 With the increasing demands for power and miniaturisation driving thermal management issues, as well as SMT, CSP and PTH reliability, Indium Corporation is offering a comprehensive program that focuses on the products, services, and technologies to support a process engineer's goal of optimising finished goods reliability
This article was originally published on Electronicstalk on 18 Apr 2006 at 8.00am (UK)
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Pb-free soldering products on show at APEX
Indium Corp will be exhibiting a number of Pb-free soldering products at APEX on Booth 1347.
This programme is customer-driven, reliability-focused and field-proven.
Indium's team of experts will be available on Booth 2D35 to answer questions and provide information.
Indium's reliability product exhibit will feature its award-winning NF260 no-flow underfill, as well as the Indium5.1 series of Pb-free no-clean solder pastes.
NF260, winner of the Global Technology Award and Vision Award, is the world's first reworkable, air reflowable and Pb-free no-flow underfill.
NF260 delivers increased reliability one order of magnitude over the leading competitor and two orders of magnitude over no underfill at all.
CSP reliability is enhanced, by addressing joint cracking due to brittle Pb-free alloys, and reduced joint size due to miniaturisation.
Indium's 5.1 series of Pb-free no-clean solder pastes improves SMT reliability with: industry leading "response-to-pause" printability; excellent wetting to all common Pb-free metallisations; low voiding across a wide variety of reflow profiles; and unsurpassed print transfer efficiency through small apertures.
Nepcon/EMT China is the leading SMT trade event offering visitors a variety of SMT solutions.
This is a unique platform to network with trade professionals in the SMT community in China, and get the latest information on newest products.
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