Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: NF260 No-Flow Underfill
Edited by the Electronicstalk Editorial
Team on 18 April 2006
No-flow underfill stars in Shanghai
NF260 no-flow underfill has been awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China.
Indium Corporation's NF260 no-flow underfill has been awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China Sponsored by EM Asia Magazine, the Innovation Award recognises, rewards, and celebrates excellence in the Asian electronics industry
This article was originally published on Electronicstalk on 5 Dec 2005 at 8.00am (UK)
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Novel no-flow underfill wins technology award
Indium Corporation has received the Global Technology Award for its NF260 no-flow underfill.
No-flow underfill wins award at APEX
NF260 No-Flow underfill won the 2006 Vision Award at the APEX show in Anaheim, California.
Indium's NF260 No-Flow Underfill also earned the Global Technology Award at Productronica in November 2005 and the Vision Award at APEX in February 2006.
NF260 is the world's first reworkable, air reflowable, Pb-free no-flow underfill.
This remarkable product delivers increased reliability one order of magnitude over the leading competitor and two orders of magnitude over not using an underfill.
CSP reliability is enhanced by addressing joint cracking due to brittle Pb-free alloys, and reduced joint size due to miniaturisation.
It also provides cost savings and improved performance.
Designed for Pb-free assembly, NF260 is fully compatible with the SMT process and offers a wide process window to accommodate solder reflow and underfill curing.
The underfill curing is completed in one reflow pass and no post-cure is required.
NF260 saves money by utilising existing automated equipment and by enabling processing in typical Pb-free reflow profiles.
It promotes excellent wetting, low-voiding, and durability in thermal cycling.
It also provides the necessary strength to withstand the most rigorous drop tests, including surpassing endurance expectations, with no failures after more than 450 drop tests.
Under similar conditions, unfilled soldered connections typically fail after fewer than 10 drops.
NF220 is also available for SnPb applications.
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