Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 21 April 2006
Reliability in focus at Boston show
Indium Corporation will highlight its reliability programme at Nepcon East/Electro on 10th and 11th May 2006 in Boston.
Indium Corporation will highlight its reliability programme at Nepcon East/Electro on 10th and 11th May 2006 in Boston Indium's team of experts will be available at Booth 3017 to answer questions and provide information
With the increasing demands for power and miniaturisation driving thermal management issues, as well as SMT, CSP and PTH reliability, Indium Corporation is offering a comprehensive programme that focuses on the products, services, and technologies to support a process engineer's goal of optimising finished goods reliability.
This programme is customer-driven, reliability-focused and field-proven.
Indium's reliability product exhibit will feature NF260, the world's first reworkable Pb-free no-flow underfill and winner of the Global Technology Award, Vision Award and EM Asia Innovation Award, as well as the Indium 5.1 series of Pb-free no-clean solder pastes.
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