Lead-free solder reliability in focus
An
Indium Corporation of America product story
Edited by the Electronicstalk editorial team
May 22, 2006
Dr Yan Liu will review her findings on the reliability of lead-free soldering in a presentation to be delivered at the SMTA/CAVE Harsh Environment Electronics Workshop in Indianapolis.
Indium Corporation's Research Chemist, Dr Yan Liu will review her findings on the reliability of lead-free soldering in a presentation to be delivered at the SMTA/CAVE Harsh Environment Electronics Workshop in Indianapolis on 19th and 20th July 2006.
Dr Liu's presentation will emphasise the effects on finished goods reliability attributable to: solder alloys, surface finishes, the microstructure of lead-free joints, mixed alloy compatibility, and alloy converging.
She will also discuss the failure mechanisms of grain boundary sliding and cavitation, grain and IMC size, Kirkendall voiding and fragile SAC joints.
Dr Liu has a PhD from Salford University in the UK.
She is based at Indium Corporation's Global R and D centre in Clinton, New York.
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