Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: Reliability Programme
Edited by the Electronicstalk Editorial
Team on 27 June 2006
Reliability programme featured at
Semicon West
Indium Corporation will highlight its Reliability Programme at its exhibit at Semicon West from 10th to 14th July 2006 at the Moscone Center in San Francisco.
Indium Corporation will highlight its Reliability Programme at its exhibit at Semicon West from 10th to 14th July 2006 at the Moscone Center in San Francisco With the increasing demands for power and miniaturization driving thermal management issues as well as CSP Reliability, Indium Corporation is offering a comprehensive program that focuses on the products, services, and technologies to support a process engineer's goal of optimising finished goods reliability
This article was originally published on Electronicstalk on 14 Jan 2004 at 8.00am (UK)
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This programme is customer-driven, reliability-focused and field-proven.
Products featured at the show will include NF260, the world's first reworkable, Pb-Free no-flow underfill and winner of the Global Technology Award, SMT Magazine Vision Award, and EM Asia Innovation Award.
Also featured will be WS-366 ball attach flux, a high-viscosity, water-soluble interconnect flux that offers high yields in the BGA bumping process.
Semicon West is the largest exposition in North America dedicated to showcasing the technologies that enable the design and manufacture of micro and nano-scale electronics, including semiconductors, micro-electromechanical systems (MEMS), flat panel displays (FPDs) and related devices.
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