Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: Indium5.1AT
Edited by the Electronicstalk Editorial
Team on 02 October 2006
Pb-free solder paste cleans up award
Indium Corporation has been recognised with a Global Technology Award for its Indium5.1AT Pb-free solder paste.
Indium Corporation has been recognised with a Global Technology Award for its Indium5.1AT Pb-free solder paste Sponsored by Global SMT and Packaging magazine, the award acknowledges outstanding innovations in the printed circuit assembly and packaging industries
This article was originally published on Electronicstalk on 4 May 2007 at 8.00am (UK)
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Pb-free solder paste is top innovation
Indium5.1AT Pb-free solder paste has won the Innovation Award at Nepcon China.
It was presented at Assembly Technology Expo in Rosemont, Illinois USA.
Indium5.1AT is an air reflow, no-clean solder paste that provides increased finished goods reliability when compared with competitive solder pastes.
It features ultra low voiding (in the 5% range) when soldering BGAs with micro via-in-pad designs.
No other solder paste is known to exceed this level of performance.
In addition, Indiumt5.1AT was specifically formulated to minimise the impact of downtime on printed deposit volumes, ensuring a consistently high reliability onboard assembly.
This gives customers increased reliability while at the same time saving them money.
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