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Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 05 October 2006
Summit gathers engineering staff
Indium Corporation hosted its 4th Annual Global Technical Summit for its technical support and applications engineers last month in Clinton, New York.
Indium Corporation hosted its 4th Annual Global Technical Summit for its technical support and applications engineers last month in Clinton, New York Over 40 delegates from Asia, Europe, Mexico and the USA participated
The technical summit provided an opportunity for Indium's global network of technical engineers to learn about new products, current research, and break-through developments in the industry, as well as to present case studies, share expertise, and network with each other.
The agenda also included presentations by Dr Claudius Ferger, Manager of Advanced Plastic Packaging at IBM's Thomas J Watson Research centre, Dr Ning-Cheng Lee, Vice President of Technology at Indium Corporation, and Dr Ronald C Lasky, Senior Technologist at Indium Corporation.
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