Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial
Team on 16 April 2007
Soldering and reliability in the
spotlight
Dr Ning-Cheng Lee will lecture on metallurgical fundamentals and optimal processes at the International Conference on Soldering and Reliability in Toronto.
Indium Corporation's Vice President of Technology, Dr Ning-Cheng Lee, will lecture on metallurgical fundamentals and optimal processes at the International Conference on Soldering and Reliability in Toronto, Ontario, Canada on from 17th to 19th April 2007 Dr Lee will also teach a 6-hour short course on creating high reliability for Pb-free solder joints at Nepcon Shanghai from 24th to 27th April 2007
This article was originally published on Electronicstalk on 14 Jan 2004 at 8.00am (UK)
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In both presentations Dr Lee will emphasise implementing reliable Pb-free assembly processes by overcoming technical issues and challenges.
He will focus on: Pb-free legislation status; Pb-free alloys, surface finishes, components and substrates; Pb-free wave soldering, rework and inspection; and reliable solutions to common problems in Pb-free SMT assembly.
Dr Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of solder alloys, solder fluxes, solder pastes, high-temperature polymers, encapsulants for microelectronics, underfills and adhesives.
His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
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