Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: Indium5.1AT
Edited by the Electronicstalk Editorial
Team on 04 May 2007
Pb-free solder paste is top innovation
Indium5.1AT Pb-free solder paste has won the Innovation Award at Nepcon China.
Indium Corporation's Indium5.1AT Pb-free solder paste has been awarded the Innovation Award at Nepcon China in Shanghai, China Sponsored by EM Asia Magazine, the Innovation Award recognises excellence in the Asian electronics industry
This article was originally published on Electronicstalk on 2 Oct 2006 at 8.00am (UK)
Related stories
Pb-free solder paste cleans up award
Indium Corporation has been recognised with a Global Technology Award for its Indium5.1AT Pb-free solder paste.
This is the third award for Indium Corporation's Indium5.1AT solder paste.
It was awarded the Global Technology Award in 2006 and the 2007 SMT China Vision Award earlier this year.
It is the second consecutive year that Indium Corporation has been recognised with an award by EM Asia Magazine.
Indium Corporation won an Innovation Award for its NF260 no-flow underfill in 2006.
Indium5.1AT is an air-reflow, no-clean solder paste that provides increased finished goods reliability when compared with competitive solder pastes.
It features ultra low voiding (in the 5% range) when soldering BGAs with micro via-in-pad designs.
No other solder paste is known to exceed this level of performance.
In addition, Indium5.1AT was specifically formulated to minimise the impact of downtime on printed deposit volumes, ensuring a consistently high reliability onboard assembly.
This gives customers increased reliability while at the same time saving them money.
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