Product category:
Communications ICs (Wired)
News Release from: IDT | Subject: RC32334 and RC32332
Edited by the Electronicstalk Editorial
Team on 19 July 2002
Comms processors boost PCIbus throughput
IDT has new versions of its RC32334 and RC32332 integrated communications processors, featuring performance enhancements of up to four times the PCI throughput of the previous device revision.
IDT has new versions of its RC32334 and RC32332 integrated communications processors, featuring performance enhancements of up to four times the PCI throughput of the previous device revision The devices also include an enhanced SDRAM controller, enabling a direct connection and easy interoperability with the latest generation of x32 SDRAM devices, and are backward pin and software-compatible with the previous devices to ensure a simple upgrade path for existing customers
This article was originally published on Electronicstalk on 12 Apr 2001 at 8.00am (UK)
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The new devices were designed at IDT's its newest design centre in Warren, New Jersey and these enhancements focus on high-growth communications applications in the Enterprise market, including wireless access points, SOHO gateways and virtual private networks (VPNs).
Market trends have increased the bandwidth requirements on the PCIbus.
In Ethernet switching applications, where the PCI interface is used as a control bus for managing a switch fabric, system vendors are adding multiple switch fabrics to develop higher-port-count fast Ethernet and gigabit Ethernet platforms.
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For the wireless access points, the emergence of wireless LAN chipsets, offering five times the bandwidth delivered by the existing 802.11b-based solutions, and the increased demands to accelerate the processing of IPSec algorithms, have driven IDT to enhance the PCI interface to support the transfer of large blocks of data from PCI-based peripherals more efficiently.
IDT's New Jersey design centre opened in November 2001 and includes a staff with significant system-level expertise that concentrates on defining the internal architecture of next-generation integrated communications processors and in specifying the functionality of on-chip I/O modules to optimise system bandwidth for specific end applications.
"As the system bandwidth demands for communications applications near the edge of the network increase, a key challenge for the semiconductor supplier becomes the ability to optimise the sustainable bandwidth that can be supported across the on-chip I/O interfaces rather than just integrate off-the-shelf IP modules", said Jeff Lukanc, director of design for IDT's Internetworking Products Division.
"IDT's New Jersey design centre is a key resource for us to continue to architect integrated solutions that couple communications-specific and generic I/O interfaces with value-added IP to deliver compelling system bandwidth at unparalleled device cost points".
In addition to the New Jersey design centre, IDT has design teams in Atlanta, Georgia; Dallas, Texas; Santa Clara, California; Shanghai, China; and Sydney, Australia.
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