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Product category: Standard Logic Devices
News Release from: IDT | Subject: AMB+
Edited by the Electronicstalk Editorial Team on 14 May 2007

Buffer cuts FB-DIMM power budgets

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Third generation memory buffer family offers the lowest power consumption available in the industry today - up to 40% power savings over competing AMB offerings.

Integrated Device Technology has unveiled the third generation device in its Advanced Memory Buffer family, the Advanced Memory Buffer Plus (AMB+), which offers the lowest power consumption available in the industry today - up to 40% power savings over competing AMB offerings Compliant with the JEDEC AMB specifications, the IDT AMB+ device is an essential building block in fully buffered dual inline memory modules (FB-DIMM) for high-performance, low-power computing platforms

The IDT AMB+ meets the increasing memory storage requirements of servers and workstations that must achieve higher performance to support the demands of e-commerce, web-hosting, enterprise and other mission-critical applications.

The challenge for these computing platforms is to continue to scale memory performance and capacity, while reducing power consumption to fit within the tightening constraints of ever-growing data centres.

The AMB+ located on each FB-DIMM collects and distributes the data from or to a DIMM, buffers the data internally on the chip, and receives or forwards it to the next DIMM or memory controller.

Designed from the start in anticipation of the power concern surrounding data centres, the AMB+ reduces memory subsystem power consumption by up to 40%, enabling increased compute capacity within existing infrastructure, while reducing operating expenditure.

In addition to savings derived directly from low power consumption, the collateral reduction of thermal levels significantly reduces system cooling requirements, allowing deployment of low-noise cooling mechanisms in servers, which has not been practical until now.

The IDT AMB+ is a drop-in, ready-to-use solution that immediately provides twenty-five% savings over previous solutions, even while operating with DDR2-800 DRAMs.

Additional power savings can be achieved by special provisioning incorporated in the device, such as an optional 1.5V core power supply, instead of traditional 1.8V.

Consequently, a full-module heat-spreader may no longer be necessary, significantly reducing bill of material costs and increasing packing density.

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