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Faster erasing for 32Mbit Flash memory

Edited by the Electronicstalk editorial team Apr 1, 2004

Silicon Storage Technology has developed a high-performance 32Mbit Flash chip that boasts typical chip erase time of just 40ms.

Silicon Storage Technology has developed a high-performance 32Mbit Flash chip that boasts typical chip erase performance of 40ms, in sharp contrast to the typical 60s or more required by competing 32Mbit Flash devices.

The new device is available from Infocus UK.

Benefiting from the performance advantages inherent in SST's new 0.18-micron self-aligned SuperFlash process technology, the SST39VF320 is the latest introduction in the popular family of MPF multipurpose Flash devices.

The new technology enables individual sectors of the device to be erased 50 to 100 times faster than conventional Flash devices, thereby reducing power consumption and eliminating manufacturing bottlenecks.

According to InFocus UK's Darrell Williamson, the new device offers a performance leap over conventional Flash devices and can be a cost-effective alternative to multibank Flash devices: "The SST39VF320 enables customers to update their code and data much faster at the manufacturing stage or in-system, and the 6 x 8mm TFBGA package is the ideal form factor for portable applications", said Williamson.

The SST39VF320 will find ready applications in end products such as digital cameras, DVD players, DVD recorders, PDAs, MP3 players, digital TVs, printers, DSL equipments and networking devices.

Key features of the 32Mbit SST39VF320 include: single-voltage 2.7-3.6V read and write operations; low power consumption - typical active current is 9mA and typical standby is 3uA; fast programming typically 7us per word; fast erase times - 18ms per 2Kword sector (typical), 18ms per 32Kword block (typical) and a maximum of 50ms per chip; fast read access time of 70 or 90ns; a small uniform sector size of 4Kbyte per sector; 100 years data retention; CMOS I/O compatibility; and JEDEC standard command sets and pinouts.

The device is available in two packages: a 48-lead TSOP (12 x 20mm) or a 48-ball TFBGA (6 x 8 x 1.1mm).