Product category:
Intellectual Property Cores
News Release from: Ignios
Edited by the Electronicstalk Editorial
Team on 04 November 2004
Discover potential of complex multicore
chips
Ignios to make presentation on embedded multicore chips and new SystemWeaver software at Electronica 2004.
Visit the Ignios stand (Stand A6.650 Hall A6) at Electronica 2004 and discover how SystemWeaver enables software developers to make full use of the price, performance and power potential offered by complex multicore chips Learn about why multicore is emerging as the basis for many next-generation chip architectures in both the PC/Server and embedded markets
This article was originally published on Electronicstalk on 13 Jun 2005 at 8.00am (UK)
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Reference platform shows off multicore DSP
A new reference platform demonstrates multiple CEVA-Teak DSP cores seamlessly operating together using Ignios' multicore-enabling SystemWeaver technology.
Learn about how multicore is moving into the mainstream for embedded systems, why it will be used in a far wider range of applications and why multicore chips are becoming more complex.
Find out how multicore hardware can be made software-friendly, improving product costs and time to market, and how compatibility with existing hardware and software designs can be leveraged.
Presentation: "Unlocking the full software potential of embedded multicore chips - introducing SystemWeaver from Ignios" presented by Ignios Founders: chief technology officer, Mark Lippett and VP Business Development, Dan Chester at 3.30 pm November 9th 2004.
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