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iNEMI (International Electronics Mfg Initiative)
2214 Rock Hill Road
Suite 110
Herndon
VA 20170-4214
USA
Latest articles from this company
News releases from this company
Guidelines help with Pb-free alloy diversity
Although SAC 305 and 405 have been the most commonly used Pb-free alloys to date, they do not meet all of industry's needs for all applications.
News from Electronicstalk, 10 July 2008
Book presents six years of lead-free research
Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder.
News from Electronicstalk, 5 November 2007
Call for clarity in lead-free part numbering
iNEMI members support move to create unique part numbers for BGA components to differentiate any Pb-free ball metallurgies other than SAC 305 or SAC 405.
News from Electronicstalk, 8 May 2007
Expo provides sneak preview of 2007 roadmap
iNEMI will preview highlights of its 2007 roadmap at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit in Los Angeles, California.
News from Electronicstalk, 16 January 2007
Task group tackles continuing lead problems
The iNEMI SnPb BGA Availability Task Group will address the needs of OEMs that are taking the lead exemption from the RoHS Directive.
News from Electronicstalk, 10 November 2006
Medical components to gain reliability specs
Project seeks to develop testing and use condition guidelines to help assure reliability of electronic components used in medical applications.
News from Electronicstalk, 11 August 2006
Guidelines for high reliability sub-assemblies
The INEMI High-Reliability RoHS Task Force has released a set of guidelines regarding assembly processes and reliability requirements for RoHS5 and RoHS6 subassembly modules
News from Electronicstalk, 27 June 2006
Reports reduce the risk of tin whiskers
JEDEC and the International Electronics Manufacturing Initiative have published two documents to help manufacturers reduce the risk of tin whiskers in lead-free products.
News from Electronicstalk, 8 May 2006
Workshop tackles tin whiskers
iNEMI and the IEEE Components, Packaging and Manufacturing Technology Society will cosponsor the third annual Tin Whisker Workshop at the 56th Electronic Components and Technology Conference.
News from Electronicstalk, 18 April 2006
Deadline approaches for roadmap workshop
Anyone interested in participating in the International Electronics Manufacturing Initiative's roadmap workshop has less than a week to register.
News from Electronicstalk, 23 March 2006
Task force reports on lead-free reliability
iNEMI's High-Reliability RoHS Task Force has published recommendations for Pb-free manufacturing of complex, thermally challenging electronic assemblies.
News from Electronicstalk, 9 March 2006
Roadmap workshop coincides with Semicon Europa
The International Electronics Manufacturing Initiative has scheduled a roadmap workshop for Wednesday 5th April 2006, to coincide with Semicon Europa in Munich.
News from Electronicstalk, 28 February 2006
Implementation of MCD exchange standards discussed
The IPC and the iNEMI will host a session at Productronica (Munich) to discuss the implementation and industry adoption of material composition data (MCD) exchange standards.
News from Electronicstalk, 8 November 2005
Roadmap on the Productronica agenda
The International Electronics Manufacturing Initiative will hold the first regional meeting to kick off its next industry roadmap at the Productronica trade fair in Munich next month.
News from Electronicstalk, 21 October 2005
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