Expo provides sneak preview of 2007 roadmap

iNEMI will preview highlights of its 2007 roadmap at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit in Los Angeles, California.

The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium, will preview highlights of its 2007 roadmap at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit in Los Angeles, California.

The iNEMI roadmap will be featured in a conference keynote session at 0800local time on Thursday 22nd February 2007.

The 2007 roadmap will not be released to industry until after 5th March, but this keynote session will provide a "sneak peek" at some of the key highlights and trends identified by the roadmap.

It will also take a look at some of the details from the newest chapter - "Organic and printed electronics technology".

Development of this latest edition of the iNEMI roadmap involved more people from more countries than any roadmap to date.

In 2004, iNEMI began proactively recruiting global participation in the roadmapping process.

For the 2007 roadmap, iNEMI broadened international input by holding a series of regional workshops to review work in progress and solicit input.

In addition to the usual North American workshop, iNEMI also hosted meetings in Germany and China.

The result is a much more global perspective than any previous roadmap.

iNEMI has also scheduled additional forums and meetings, to be held as part of, or in conjunction with, the conference.

The "Optimising lead-free processes" Forum (Tuesday 20th February 2007, 1330-1500) will review some of iNEMI's Pb-free projects that focus on Pb-free processes in areas such as wave soldering, rework and mixed soldering.

This session is one of the conference's free forums.

iNEMI is a cosponsor of IPC's Reliability Summit: "Keeping industry reliability test protocols current with rapidly changing markets" (Friday 23rd February, 0800-1700).

This free one-day session will discuss current industry initiatives to standardise reliability testing, the challenges of keeping pace with new technologies and new markets, and plans for a path forward.

This summit is organised in co-operation with the Government Electronics and Information Technology Association (GEIA), HDPUG and JEDEC.

Several iNEMI Technology Integration Groups (TIGs) will hold "gap analysis" meetings at the Printed Circuits Expo, APEX and Designers Summit.

These meetings are the first step in mining roadmap results to develop the 2007 iNEMI Technical Plan and Research Priorities.

Each roadmap chapter includes a list of gaps that are categorised and prioritised by iNEMI's TIGs and Technical Committee.

These gap analysis meetings will be used to discuss and prioritise gaps, outline technical plans and identify potential projects.

The TIG meetings are as follows: "Heat transfer", Wednesday 21st February, 0900-1200; "Optoelectronics", Wednesday 21st February, 1300-1600; "Environmentally conscious electronics", Wednesday 21st February, 1300-1600; and "Board assembly and substrates (including discussion of test)", Thursday 22nd February, 0800-1200.

Back to top