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IMEC
Address:
Kapeldreef 75
B-3001
Leuven
Belgium
Telephone: (Belgium) +32 16 28 18 80
http://www.imec.be
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Listing of all 97 news releases from IMEC:
EEG system draws power from waste body heat
IMEC's battery-free wireless two-channel EEG system has a thermoelectric generator that uses the heat dissipated from a person's temples and silicon photovoltaic cells.
News from IMEC ( 9 April 2008)
CMOS courses suit management and engineers
Plasma Etching for CMOS Technology and ULSI Applications explains the performance and limitations of plasma processes for CMOS applications and ULSI.
News from IMEC ( 1 April 2008)
C coding system suits multiprocessor systems
The highly interactive CleanC environment allows for detection of fragments in sequential C code that are potentially hard to analyse by the MPSoC design tools
News from IMEC ( 6 March 2008)
RFID tags handle barcode jobs
The new RFID system consists of a low-cost inductive antenna, capacitor, plastic rectifier and plastic circuit, all on foil.
News from IMEC ( 7 February 2008)
Research agreement targets sub-32nm memory
PSC will collaborate with IMEC's advanced lithography program addressing immersion, double patterning and EUV lithography challenges.
News from IMEC (30 January 2008)
Design company sets up Taiwanese facility
The establishment of IMEC Taiwan follows several memoranda of understanding and collaborations between IMEC and Taiwanese companies, R and D institutes and universities.
News from IMEC (23 January 2008)
EUVL experiments explore manufacturing options
The collaboration between CNSE and IMEC will also involve scientists from IBM and ASML, which has built the world's first full-field EUVL R and D tool, the Alpha Demo Tool.
News from IMEC (22 January 2008)
Video decoding receives efficiency boost
The application of data transfer and storage exploration transformations enabled intelligent re-use of the memory footprint.
News from IMEC (17 January 2008)
Indian alliances expand semiconductor R and D
New agreements expand the scope of R and D collaboration with Indian semiconductor companies and institutes.
News from IMEC ( 7 November 2006)
Multiproject wafer service expands into Europe
IMEC, and TSMC have announced the extension of IMEC's Europractice service with the offering of TSMC's technologies.
News from IMEC (12 October 2006)
Record number of papers for San Francisco IEDM
IMEC will present 17 papers together with its core partners at the IEEE International Electron Devices Meeting from 11th to 13th December 2006 in San Francisco.
News from IMEC (28 September 2006)
Icos vision systems and IMEC collaborate
icos Vision Systems and IMEC have agreed to work together in the field of inspection and metrology for three dimensional (3D) packaging
News from IMEC (28 July 2006)
New partner for CMOS research platform
Micron becomes ninth core partner within IMEC's (sub)-32nm research platform.
News from IMEC (13 July 2006)
193nm immersion lithography research extended
IMEC shifts lithography program towards hyper-NA immersion, double-patterning immersion and EUV
News from IMEC (13 July 2006)
Process paves the way to low-cost power devices
IMEC has demonstrated the growth of low-sheet-resistivity AlGaN/GaN high-electron mobility transistors on 150mm silicon wafers.
News from IMEC (30 May 2006)
Riber brings MBE system to Ge and III-V research
Riber has joined IMEC's Industrial Affiliation Programme on Germanium and III-V devices for CMOS beyond the 22nm node.
News from IMEC (22 May 2006)
3D graphics player uses MPEG-4 tools
IMEC and the Institut National des Telecommunications in France, have jointly developed the first 3D graphics player for mobile phones based on MPEG-4 3D graphics coding tools.
News from IMEC (12 May 2006)
NiSi integration offers path below 45nm
IMEC has announced a simple CMOS integration scheme of a NiSi gate for NMOS and a Ni2Si gate for PMOS on HfSiON with simultaneous two-step silicidation.
News from IMEC ( 9 December 2005)
Research addresses sub-45nm analogue challenges
A new industrial affiliation programme on analogue/RF CMOS for the 45nm era aims to keep conquering the challenges of the international technology roadmap for semiconductors.
News from IMEC (21 October 2005)
TSMC joins in with sub-45nm CMOS research
Taiwan Semiconductor Manufacturing Company has become a core partner in IMEC's sub-45nm CMOS research programme.
News from IMEC (20 October 2005)
Profiling technique opens up nitride-based memory
Laboratory to further neuroelectronics research
Japanese supplier adopts wafer drying process
Immersion lithography set for volume manufacturing
New centre to focus Belgian and Dutch research
Hardware upgrades immersion lithography
Project aims for novel oscillator for wireless ICs
Centre focuses on packaging and system integration
Front-end tools are successfully installed
Conference papers divulge Pb-free advances
Multiple-gate FETs star at VLSI symposium
New learning centre to host brainstorm sessions
Collaboration targets multimedia design flow
Thin-film process aids passive integration
Samsung joins in mobile terminal research
Small claims for novel SRAM cell
Collaboration on EUV lithography defined
Big guns unite in immersion lithography consortium
New company masters LCOS microdisplays
Programme focuses on system-level integration
Equipment suppliers join in sub-45nm research
Programme to enhance reconfigurable technology
Programme seeks novel nanotechnology solutions
Field-programmable logic event comes to Antwerp
3D package houses wireless body sensor
MIMO system uses SDMA for IEEE802.11n
Research investigates future embedded RAM schemes
Sopra signs up for ellipsometric porosimetry
TI increases involvement in sub-45nm CMOS research
Nanoelectronics laboratory takes shape
Rad-hard library gains novel output driver
Programme on reconfigurable multiprocessor systems
Philips extends research contract
More wise approach to multifunction device design
Design methodology cuts down manual coding
Design tool licence enables Silicon Valley startup
Programme to investigate immersion lithography
Multiple antenna technology offers broadband WLANs
Wireless grid to lay the foundations broadband
LEA and Europractice co-operate on xDSL ASICs
Materials research aims for sub-45nm processes
More support for germanium initiative
Transatlantic accord targets AMIS ASICs
Co-operative research proves financially sound
Tool produces optimised memory architectures
Novel processes improve on-chip inductors
Collaboration produces new-generation SiGe process
Programme to accelerate 157nm lithography
Infineon joins reconfigurable systems programme
New philosophy for research programmes
Programme lowers the ASIC entry bar
Mixed-signal simulation on show at DATE
Research fab to aim below 45nm
Matsushita joins European research initiatives
Easy foundry access for smaller projects
Xilinx joins reconfigurable systems programme
Programme focuses on "smart environments"
Research foundry to stay two steps ahead
Wavelet transform IP block aids image compression
Major progress reported in 157nm lithography
Centre of excellence targets reliability
IMEC joins the Open SystemC Initiative
Program focuses on reconfigurable systems
Multimedia demonstrator on show at DAC
IMEC and STARC to advance SoC design methods
IMEC looks to China for development
R and D expands as IMEC revenues rise
IMEC looks east for process collaboration
Programme puts a fine line on lithography
Easy entry to Alcatel ASIC process
IMEC opens business development office in China
