Programme puts a fine line on lithography

IMEC Industrial Affiliation programmes offer partners the advantages of both reduced costs and early process knowledge.

In 1999, IMEC announced its IIAP on 193nm lithography, using the first ASML PAS5500/900 full-field step-and-scan system (maximum NA of 0.63), to accelerate the introduction of 193nm technology.

This programme has focused on the critical lithography levels of 130 and 100nm CMOS technology and development of these technologies is continuing.

Although 193nm lithography will be introduced for volume manufacturing of the 100nm technology node, it has become clear that the technology can and must be pushed well beyond 100nm, using new generation step-and-scan systems equipped with higher NA lenses.

In order to continue the development work required to meet this objective, IMEC has extended its IIAP throughout 2002 and 2003, using ASML's PAS5500/1100 high NA 193nm step-and-scan system (maximum NA of 0.75), interfaced to a TEL Clean Track ACT8 advanced resist coat/development track.

The system is currently under installation in IMEC's 8in pilot line and is expected to become operational during March 2002.

Work during the programme extension aims to push 193nm lithography to k1 factors of 0.35-0.3 for the critical lithography levels.

Using the 0.75 NA of the lens, resolutions of 90 to 75nm can be achieved.

Special emphasis will be paid to the contact hole level, which has been ambitiously set by the ITRS roadmap and which is generally considered as the biggest hurdle for optical lithography.

As even higher NA lenses become available, the programme will form the basis for further development of 193nm lithography.

It will investigate high-NA effects in greater detail, in the quest for the more aggressive optical extension techniques required by manufacturing.

The programme is also a significant stepping-stone to 157nm lithography, which will require ultra-high NA lenses and aggressive optical extension techniques as well.

The resist, lens and reticle quality for 157nm lithography are currently not yet mature enough to investigate these effects properly.

IMEC is inviting participation in the programme by semiconductor manufacturers, material suppliers (resist, ARC), mask shops and peripheral lithography equipment suppliers.

IMEC Industrial Affiliation programmes offer partners the advantages of both reduced costs and early process knowledge.

IMEC's industrial affiliation programme (IIAP) formula is recognised worldwide as one of the most successful partnership schemes in research and development.

The collaborations are based on shared costs and risks and are built on sound intellectual property rules.

Thirteen IIAPs in other research fields are already in progress.

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