Body area network programme

IMEC has launched a new multidisciplinary programme aimed at developing a body area network (BAN) for health and comfort monitoring.

IMEC has launched a new multidisciplinary programme aimed at developing a body area network (BAN) for health and comfort monitoring.

Combining both micro- and nanotechnology, the network will consist of interactive, highly miniaturised, autonomous sensors.

Although potential applications such as EEG (electroencephalogram), ECG (electrocardiogram), endoscopy, sports monitoring, diagnostics and artificial organs will each have unique requirements, all the sensors will be based on a generic sensor platform that consists of the following elements: power supply, wireless transceiver, control, sensor, package.

The sensors in a body area network will have to interact with the user, with other sensors and with actuators.

This interaction must be transparent and therefore has to take place over a wireless link.

In addition, the sensors will be highly miniaturised so as not to interfere with the normal functioning of the user.

They will also have to be autonomous throughout their entire lifetime.

IMEC is creating knowhow for the sensor system, the subcomponents of the sensor platform and for processing technologies.

At the system level, it is concentrating on wireless communication in and around the human body; ad-hoc networking of wireless nodes; reliability, accuracy and sensitivity issues; position determination; and design technology for a fast reproducible design cycle.

At the components level, IMEC is focusing on the following elements: the power supply - micromechanical power MEMS, solar cells, energy storage; a low-power wireless transceiver - low-power coding, modulation techniques.

low-power front-ends; and the sensor - low-power read-out electronics.

At the technology level, issues to be dealt with include: functionalisation of electric surfaces for biosensors - self-assembling monolayers; packaging - ultra-dense packaging, 3D packaging, semi-permeable and hermetical packaging, integrated passives; wafer thinning; ultra-low power CMOS technology; micromachining; horizontal integration - adding functionality such as sensors and MEMS to CMOS; and disposable technologies such as polymer electronics.

IMEC is well placed to perform such crossdisciplinary research because of its in-house technical expertise across various disciplines.

For its partners, IMEC can act as the link between fundamental research results and market demands.

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