Product category:
Design and Development Software
News Release from: IMEC
Edited by the Electronicstalk Editorial
Team on 28 July 2006
Icos vision systems and IMEC collaborate
icos Vision Systems and IMEC have agreed to work together in the field of inspection and metrology for three dimensional (3D) packaging
Icos Vision Systems Corporation NV, a leading supplier of inspection solutions for the semiconductor industry and IMEC, a world-leading independent research centre in nanoelectronics and nanotechnology, have agreed to work together under a two-year Joint Exploration and Development Program (JEDP), in the field of inspection and metrology for three dimensional (3D) packaging According to market analysts, the market for 3D packaging will grow rapidly over the next years, driven by the quest for smaller and higher performance Integrated Circuits (IC's)
This article was originally published on Electronicstalk on 20 Feb 2002 at 8.00am (UK)
Related stories
Easy entry to Alcatel ASIC process
Alcatel is offering Europractice customers worldwide access to its new high-speed 0.35um SiGe1 BiCMOS technology for prototyping and volume production.
IMEC looks east for process collaboration
IMEC has signed of a letter of intent with Semiconductor Manufacturing International Corporation to establish a long-term partnership in advanced semiconductor process technologies.
Research will be performed at the IMEC labouratories and Icos will provide technology and equipment for inspection and metrology.
The joint research program will concentrate on the development and optimisation of several 3D packaging processes for IC's, including Wafer Level Packaging (WLP), flip chip, systems-in-a-package (SiP) and micro-electromechanical systems (MEMS) and on the optimisation of the 3D metrology methods for these applications.
The program will be closely connected to IMEC's industrial affiliation program (IIAP) on 3D stacked IC's.
The IIAP program brings together the researchers of IMEC and of world-leading suppliers of IC's, to jointly develop the technologies of future generation products.
"We are impressed with IMEC's research programs on semiconductor packaging and are delighted to join their international consortium," said Gust Smeyers, Icos' Senior Vice President for Research and Development.
"We look forward to working together with IMEC and the largest IC manufacturers around the world on the development of advanced 3D packaging processes".
"This program underscores our technical leadership in our field and our unrelenting commitment to invest in the technologies and products of the future".
"Packaging is becoming an increasingly important part of semiconductor manufacturing and we are expanding our research efforts in the packaging field, including a large research program on 3D packaging," said Gilbert Declerck, CEO of IMEC.
"We are delighted to work with Icos on the advancements of the 3D packaging processes and the metrology tools that are needed".
• IMEC: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
