Conference to address low-cost device packaging
An
IMAPS-UK product story
Edited by the Electronicstalk editorial team
Jan 19, 2005
A major conference on "Low cost packaging for tomorrow's applications" will be held at the Moller Centre in Cambridge UK on 1st and 2nd March 2005.
IMAPS-UK is organising a major conference on "Low cost packaging for tomorrow's applications".
The conference will be held at the Moller Centre in Cambridge UK on 1st and 2nd March 2005.
The two-day programme includes sessions on flip chip technology, photonics packaging, MEMS and power packaging, with speakers from Europe, America and Asia.
The highlight of day two will be a market watch session where key global representatives will participate in an open forum on future market trends in electronics.
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