Product category:
Exhibitions, Courses, Conferences and Training
News Release from: IMAPS-UK
Edited by the Electronicstalk Editorial
Team on 16 June 2005
Conference focuses on system in package
technology
A major conference on "Design, manufacture and test for system in package (SiP) technologies" will be held in Cambridge, UK on 7th and 8th March 2006.
IMAPS-UK is organising a major conference on "Design, manufacture and test for system in package (SiP) technologies" The conference will be held at the Moller Centre in Cambridge, UK on 7th and 8th March 2006
The two-day programme includes sessions on emerging market opportunities, SiP for harsh environments, RF and microwave SiP plus design and processing.
Day one will also include the Micro Electronics Market Watch session where well known speakers present their views on the global future of the industry before joining in an open forum discussion.
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