D-Link chooses Intersil's Prism II chipset
Another of the world's leading manufacturers of networking data communications and digital electronic products has adopted Intersil's Prism II WLAN chipset.
Another of the world's leading manufacturers of networking data communications and digital electronic products has adopted Intersil's Prism II WLAN chipset which is rapidly setting the standard for high-speed wireless LAN systems.
The Intersil chipset is at the heart of D-Link Systems' new Air DWL-Series of high speed wireless networking products including network adapters and access points aimed at the office and home networking market.
D-Link is the largest manufacturer of networking hubs in the world and second largest in network interface cards.
The new D-Link Air product range provides a complete solution for high-speed 11Mbit/s IEEE 802.11b-compliant wireless networking.
It includes WLAN PCI network card that plugs into a desktop's PCI bus slot, a PCMCIA card for a notebook PCMIA slot and Ethernet wireless access point.
An Ethernet-to-wireless bridge, allows direct connection to a broadband residential gateway or an ADSL/cable modem for high-speed wireless Internet access.
D-Link will sell these affordable wireless-networking products to retail outlets, broadband providers, and VARs for the small to medium business and home markets.
"D-Link's new Air product line gives users high speed wireless access to information, entertainment, voice, video and Internet content wherever they are in the home or office", said Larry Ciaccia, vice president and general manager for Prism Wireless Products at Intersil.
"We chose Intersil's Prism II chip as it is the most advanced wireless networking solution available on the market today", said Steven Joe, president of D-Link.
"Prism II delivers the affordability, performance, quality, and cost requirements needed to address the explosive emerging wireless market, making them the best choice to meet the demands our customers for reliable and cost effective wireless communication".
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