Product category:
Communications ICs (Wired)
News Release from: Intersil | Subject: HC55185 VoIP R-SLIC
Edited by the Electronicstalk Editorial
Team on 15 March 2001
VoIP R-SLIC triples line density and
capacity
Intersil has released what it claims to be the industry's smallest voice over Internet protocol (VoIP) ringing subscriber line interface circuit (SLIC).
Intersil has released what it claims to be the industry's smallest voice over Internet protocol (VoIP) ringing subscriber line interface circuit (SLIC) The R-SLIC is a breakthrough in higher density packaging with a leadless, ultra-thin, small footprint that allows designers to reduce the size and increase line capacity of emerging home gateway, set-top box, internet and router products
This article was originally published on Electronicstalk on 8 Jan 2001 at 8.00am (UK)
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The HC55185 VoIP ringing SLIC is only one-third the size of conventional ringing SLICs allowing designers to triple capacity in the same space.
Performance and reliability are also higher and thermal characteristics are significantly improved by providing more direct conduction paths between the IC and the printed circuit board.
Intersil's new VoIP ringing SLIC uses exposed die mount pads that make direct contact with the PC board, serving as a direct heat-sinking path and helping reduce heat.
Also lead coplanarity is not an issue because the interconnect pads are integrated into the plastic body, allowing assembly with standard production equipment and without special soldering processes.
"Combining new packaging capability with advances in SLIC technology greatly enhances our ability to deliver performance in smaller form factors", said Michael Althar, vice president of Intersil's VoIP gateway products.
"Intersil is driven by the market's demand for increased density and the ability to manage the thermal challenges of today's converging telecommunications applications".
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