RSLICs and DSP combine in development platform

Edited by the Electronicstalk editorial team Dec 11, 2001

Intersil is combining its subscriber line interface circuits with DSPs from VoicePump, to create a new four-channel, voice-over-packet development platform and reference design.

Intersil is combining its subscriber line interface circuits (SLICs) with DSPs from VoicePump, to create a new four-channel, voice-over-packet (VoP) development platform and reference design.

The combination provides manufacturers of low- to medium-density voice gateways and integrated access devices with a more cost-effective short-time-to-market system.

The reference design combines the space and power savings of four Intersil HC55185 ringing SLICs in a micro-lead-frame (MLF) package with VoicePump's programmable four-channel VP140 mixed-signal DSP.

The VP140 is a member of VoicePump's VP100 family and is designed to integrate DSP Group's TeakLite DSP core with most of the circuitry needed to accommodate four packet-voice channels in a single processor.

Intersil and VoicePump expect their joint development platform will provide customers with a complete turnkey solution that shortens time-to-market and greatly reduces engineering/design costs for VoP integrated access devices (IADs) used with voice over digital subscriber line (VoDSL), voice over Internet protocol (VoIP), or voice over broadband (VoB) technologies in general.

The HC55185 offers a novel combination of advantages not found in any other device on the market in terms of space-savings, power-savings, feature-richness, cost-competitiveness and total support, according to Rick Furtney, vice president and general manager of Intersil's Analogue Business Unit.

When used together in the same design, Intersil's ringing SLICs and VoicePump's VP140 digital signal processors can provide manufacturers of low-to-medium-density voice gateways and integrated access devices with a cost-effective short-time-to-market system.

The HC55185 is one of the newest members of Intersil's RSLIC18 family and is a full-featured ringing SLIC.

This small 7 x 7mm MLF version is specifically designed for high-density integration in integrated-access applications.

The HC55185's features include onboard ring generation, low power consumption, programmable transient current limiting, integrated MTU DC characteristics, silent polarity reversal, pulse metering, on-hook transmission, tip-open ground-start operation, balanced and unbalanced ringing, thermal shutdown with alarm indicator and one of the lowest external parts counts in the industry.