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MOSFET drivers shrink into compact packages

An Intersil product story
Edited by the Electronicstalk editorial team Jul 11, 2002

Intersil has a new range of high-performance MOSFET drivers featuring micro lead frame plastic (MLFP) packaging.

Intersil has a new range of high-performance mosfet drivers featuring micro lead frame plastic (MLFP) packaging.

These packages save significant board space and have a direct metal thermal path from driver die to the outside of the package.

The new Endura HIP2100, HIP6602B and HIP6604B MLFP-packaged drivers are ideal for power designs where space is a significant constraint and power dissipation is a concern.

Applications range from high-voltage telecomms and avionics power supplies to low-voltage DC/DC convertors for PC motherboards and peripherals.

The HIP2100 drives two N-channel mosfets in an up-to-100V half-bridge configuration.

It is offered in both 16-lead 5 x 5mm MLFP and 8-lead SOIC packages.

The MLFP package reduces mounting area by 15%, reduces thermal resistance by a significant 63% and is 42% thinner compared to the 8-lead SOIC package.

This high-frequency driver has very short propagation times enabling MHz switching frequencies and is capable of driving a 1000pF load at 1MHz with a rise and fall time of typically 10ns.

The HIP6602B is a high-frequency two-channel mosfet driver specifically designed to drive four N-channel mosfets in a dual synchronous-buck convertor topology over a range of 5 to 12V.

This dual driver is now offered in both 16-lead 5 x 5mm MLFP and 14-lead SOIC packages.

The MLFP package reduces required mounting area by 52%, reduces thermal resistance by 50% and is 42% thinner compared to the 14-lead SOIC package.

Each channel of the IC drives both upper and lower mosfet gates.

The HIP6604B is a synchronous buck mosfet driver IC available in both the 16-lead 4 x 4mm MLFP and the 8-lead SOIC packages.

The MLFP package reduces required mounting area by 46%, reduces thermal resistance by 56% and is 42% thinner compared to the 8-lead SOIC package.

This IC is a single-channel device that has the same operating characteristics as the HIP6602B.

In addition, the HIP6604B can be configured with both the upper and lower gate drives in the range of 5 to 12V, or the upper drive in the range of 5 to 12V while the lower drive is fixed at 12V giving designers the ability to optimise the power design.

Evaluation samples and application notes are available for all these drivers.

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