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Serial interfaces replace and save space

An Intersil product story
Edited by the Electronicstalk editorial team Jun 5, 2003

Intersil has made two additions to its Linearlink high-performance RS232 interface line - the ISL4260E and ISL83386E.

Intersil has made two additions to its Linearlink high-performance RS232 interface line - the ISL4260E and ISL83386E.

The ISL4260E joins the previously announced ISL424XE/ISL4238E RS232 transceivers as the worlds smallest in a tiny 5 x 5 x 0.9mm QFN package.

The ISL83386E is a 20-lead TSSOP packaged version.

Both package types are suitable for use in any handheld battery-powered space-constrained device.

The ISL4260E and ISL83386E each have three transmitters and two receivers.

Both devices operate over a 3.0 to 5.5V supply range and are fully compatible with 3V, mixed 3 and 5V, and 5V-only systems.

Each IC features a very low 300uA supply current and an even lower power-down current of only 150nA.

The ISL83386E is a pin-for-pin match with the MAX3386E and SP3203E, and is intended for use in PDAs and other handheld devices requiring an RS232 link to a PC.

Intersil's ISL424X series transceivers complete the serial communications interface on the PC end of the link.

A unique VL supply pin improves interoperation in mixed-voltage logic systems, by adjusting the input thresholds and output logic levels to match the external supply.

The RS-232 transmitters/receivers meet EIA/TIA-232 and V.28/V.24 specifications, even at 3V.

ESD protection is provided (+/-15 kV, IEC61000-4-2 air gap and human body model) on all transmitter outputs and receiver inputs.

The ISL4260E's QFN package occupies 40% less board space than the TSSOP.

Small lands on the underside perimeter provide circuit contact so there are no leads to become bent during handling or assembly.

Unlike chip-scale packages that use an array of solder bumps, the perimeter lands of the QFN package allow post assembly inspection of solder joints.

Special manufacturing equipment is not needed.

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