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Inseto (UK)

Unit 25 Focus 303
Focus Way
Andover
SP10 5NY
UK

Latest articles from this company

News releases from this company

Solder range has long lead-free pedigree

Inseto can now supply a comprehensive range of electronics grade solders and related materials from Senju, including paste, wire, spheres, bar and flux.

News from Electronicstalk, 31 July 2007

Manual wire bonders are low-cost intro

Low-cost manual fine wire bonders are ideal for startup companies, universities and laboratories.

News from Electronicstalk, 22 March 2006

Become a racing driver for the day

All visitors to Nepcon UK Stand H412 will have the opportunity to enter a free prize draw to become a racing driver for the day at the Thruxton Circuit in Hampshire.

News from Electronicstalk, 9 May 2005

Reflow ovens break new ground

A new generation of Quattro Peak ovens for medium through very high volume applications includes many novel features, which until now have not been available in a reflow oven.

News from Electronicstalk, 30 July 2004

SMD adhesive solves assembly problems

Delo-Monopox MK096 is a heat-cured, single-part epoxy resin optimised for high-speed SMT processes as well as manual processing.

News from Electronicstalk, 15 April 2004

Lead-free reflow need not cost the earth

A new range of energy efficient solder reflow and curing ovens boasts low delta-T, high performance and low operating costs.

News from Electronicstalk, 6 April 2004

Wire bonding on a budget

The low-cost TPT HB10 bonder, configured for ball and wedge bonding, is suitable for low through medium volume production of microelectronic, microwave or photonic devices.

News from Electronicstalk, 8 January 2004

Production equipment on the web

Inseto has re-engineered its website, to make it more attractive for the reader, quicker to navigate and intuitive to use.

News from Electronicstalk, 19 March 2001

Flexible approach to pick and place

Now available from Inseto is the range of highly flexible Mimot pick and place systems.

News from Electronicstalk, 26 February 2001

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