Wire bonding on a budget

The low-cost TPT HB10 bonder, configured for ball and wedge bonding, is suitable for low through medium volume production of microelectronic, microwave or photonic devices.

Inseto has introduced a new low cost wire bonder from TPT of Germany.

The bonder, configured for ball and wedge bonding, is suitable for low through medium volume production of microelectronic, microwave or photonic devices.

The HB10 is designed to offer many features only found in higher specification models, but at a much lower price, including motorized z motion and touch-down sensing, programmable bonding parameters, program storage and automatic wire feed.

For applications requiring both ball and wedge bonding, the bonder can be interchanged from one technology to the other, without changing any hardware.

This is achieved by simply changing the bonding tool and selecting the appropriate bonding mode in the systems software.

A wire feed angle of 90 degrees, provides the system with a deep-access bonding capability for 17-75um wire diameters, or ribbon bonding of up to 25 x 250um.

For ease of use, an LCD is used to access the simple menu system for adjusting parameter settings, machine configuration or for program selection.

Back to top