Product category:
PCB Assembly Equipment and Tools
News Release from: Inseto (UK) | Subject: Quattro Peak ovens
Edited by the Electronicstalk Editorial
Team on 30 July 2004
Reflow ovens break new ground
A new generation of Quattro Peak ovens for medium through very high volume applications includes many novel features, which until now have not been available in a reflow oven.
First introduced in 1997 by SMT Wertheim, the Quattro Peak range of high-volume reflow ovens sets new standards for reflow soldering The Quattro Peak range of ovens featured SMT's patented "slot nozzles" and "double peak" zone technology, resulting in exceptional energy efficiency and low delta-T results
This article was originally published on Electronicstalk on 26 Feb 2001 at 8.00am (UK)
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At the recent SMT exhibition in Nuremberg, a new generation of Quattro Peak ovens for medium through very high volume applications was presented.
Although the name is unchanged, there are many new unique features, which until now have not been available in a reflow oven.
These features include flux management in the cooling zone, which for the first time in a reflow oven, is mounted underneath the conveyor instead of above.
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When mounted above, the contaminated air is removed on the topside of the oven, cleaned in filter systems and finally, directed back to the PCB assembly.
The net effect of moving the air upward generates contamination and condensation inside the exhaust pipes, which if not maintained correctly, could drip down onto the transport conveyor.
In the new Quattro Peak L (large) the contaminated air is removed downward to the filter system, which being below the transport conveyor avoids this possibility, plus is more accessible for maintenance purposes.
The Quattro Peak L shown at SMT also features two separate cooling zones with separate air circuits, providing a controllable and gentle cooling directly behind the peak zone.
The second cooling segment with even lower air temperature provides for lower temperature of the PCB assemblies at the oven's outlet.
The new cooling concept requires neither cooling water nor a separate or integrated cooling aggregate.
Most important, however, for lead-free soldering is the efficiency of the heat transfer.
Compared to traditional tin-lead solder pastes, the lead-free pastes are much more demanding.
It is not recommended to simply increase air temperatures until the soldering process takes place.
The challenge was to develop a system for the heat transfer, which results in higher temperatures at the PCB assemblies without changing air temperatures.
To do so, the well-known slot nozzles will be replaced by a new generation of air guiding system.
Profile measurements have shown that - compared with traditional reflow ovens - the new nozzle system reduces the delta-T by up to 40%.
PCB assemblies, which up to now could be processed only in vapour phase units, can now be handled in forced convection reflow ovens.
Another advantage of the new SMT oven is the remarkable low consumption of nitrogen.
In combination with SMT's intelligent nitrogen control system a consumption of less than 10m3/h can be realised.
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