Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Intertronics | Subject: Thermoset MD-140
Edited by the Electronicstalk Editorial
Team on 09 October 2001
Single-component adhesive keeps dice in
place
Intertronics has announced the introduction of Thermoset MD-140, a silver-filled die-attach adhesive with excellent electrical and thermal performance.
Intertronics has announced the introduction of Thermoset MD-140, a silver-filled die-attach adhesive with excellent electrical and thermal performance The epoxy-based, single-component adhesive is ideally suited for use in thermally demanding, die-attach applications such as microprocessor, power semiconductor and VLSI assembly, in fact anywhere electrical conductivity combined with superior thermal performance is required for bonding to laminate, ceramic and metal substrates
This article was originally published on Electronicstalk on 2 Apr 2001 at 8.00am (UK)
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Pens dispense without a squeeze
Fisnar Flow-Seal pens from Intertronics allow the controlled application of both water and alcohol-based products including no-clean liquid fluxes, RMA liquid fluxes and solvents.
Its low stress characteristics also make it suitable for use with large dies.
MD-140 was developed for use in high-speed automated die assembly where dispensing precision and accuracy are vital.
It can be used with time/pressure, positive displacement or linear dispense heads.
Its thermal conductivity is typically three times greater than competitive silver-filled materials at 13W/mK.
Dispensing is recommended using 14 to 23 gauge needles.
The material shows excellent adhesion to a wide variety of surfaces including silicon, silver, gold and copper and can be cured in ten minutes at 150 to 180C.
It has a long pot life and can be used up to 72h after loading the syringe into the dispensing equipment.
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