Product category:
Heatsinks and Thermal Management
News Release from: Intertronics | Subject: Gelease-MG-121
Edited by the Electronicstalk Editorial
Team on 07 November 2001
Thermal grease thinks it's a gel
New from Intertronics is an innovative thermal interface material.
New from Intertronics is an innovative thermal interface material Thermoset Gelease-MG-121 combines the extremely low thermal resistance properties of a grease with the integrity of a gel
This article was originally published on Electronicstalk on 2 Apr 2001 at 8.00am (UK)
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Fisnar Flow-Seal pens from Intertronics allow the controlled application of both water and alcohol-based products including no-clean liquid fluxes, RMA liquid fluxes and solvents.
Gelease-MG-121 can be used in cross-sectional thickness as low as 1-2 thou in order to minimise the thermal pathway and maximise heat flow.
It offers the same thermal performance as a high-performance grease while minimising the possibility of bleed, separation and 'pump-out'.
Gelease-MG-121 is designed for applications such as flip chip to thermal plate, BGA to heatsink and PGA to heatsink.
The new product exhibits excellent flow properties and dispenses easier than most thermal greases.
A short, low temperature oven cure or the operating temperature of the processor itself will allow the material to gel to its final integral state.
The material's thermal resistance is 0.06-0.07Cin2/W.
It has a low modulus of elasticity (350kPa) and a very low glass transition temperature (-121C).
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