Resins for LED assemblies

An assortment of Dymax resins for LED assemblies are featured in a new application bulletin from Intertronics.

An assortment of Dymax resins for LED assemblies are featured in a new application bulletin from Intertronics.

The bulletin features seven products along with pictures of their recommended application types.

They include LEDs potted in housings, coatings for the backs of printed circuit boards onto which LEDs are mounted, the doming of photodiodes and the bonding of LEDs on to carriers.

These UV/visible light curing adhesives and coatings form bonds to plastics faster than typical UV-only curing adhesives and offer a wide range of properties including superior adhesion, multiple viscosities, minimal shrinkage and low outgassing.

Other characteristics highlighted include cure in seconds, optical clarity and excellent environmental resistance.

A variety of UV/visible curing options for the adhesives are also featured, including spot and flood lamps.

Cures occur on exposure to wavelengths from 200-500nm.

The resins contain cure mechanisms more sensitive to the spectral output of both visible and UV curing wavelengths, resulting in deeper, faster cures.

Dymax Ultra Fast and Ultra Light-Weld adhesives form strong solvent-free bonds on an expanded array of plastic and other substrates including UV absorbing clear or tinted grades of glass and plastics, as well as other semitransparent materials such as FR-4 circuit boards and white ceramics.

They form high strength structural bonds to glass, metals and plastics upon exposure to lamps emitting primarily visible as well as long wave UV light.

Ultra Fast and Ultra Light-Weld adhesives are100% free of solvents and ozone depleting compounds.

Along with their excellent depth and speed of cure, they are an ideal replacement for products containing ozone-depleting chemicals.

The use of safe Ultra Light-Weld adhesives also eliminates crazing of plastics.

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