Product category:
Electronics Manufacturing Materials and Consumables
News Release from: Intertronics | Subject: Dymax light and activator cure adhesives
Edited by the Electronicstalk Editorial
Team on 12 August 2003
Guide to electronics adhesives
A selector guide from Intertronics introduces a new range of Dymax light and activator cure adhesives for bonding metal, ferrite, ceramics and providing strain relief for various wiring assemblies.
A selector guide from Intertronics introduces a new range of Dymax light and activator cure adhesives for bonding metal, ferrite, ceramics and providing strain relief for various wiring assemblies The guide features the new 800 Series adhesives for "cold bonding" close fitting, opaque substrates such as magnets to steel housings
This article was originally published on Electronicstalk on 2 Apr 2001 at 8.00am (UK)
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According to UK distributor Intertronics, Dymax Series 800 adhesives form bonds to 3000psi on metal, ferrite, ceramic and glass surfaces.
Also shown are the Multi-Cure 600 Series adhesives that cure on surfaces in seconds when exposed to UV light.
The new products are upgrades of similar adhesives that have been used successfully for the specified applications for over 20 years.
New improvements include higher clarity of cured bonds, good gap filling and fast fixtures.
A chart depicts why these materials have simplified the assembly of DC motors, speakers, pot and e-cores, as well as wire harnesses, armatures and commutations.
In comparison with the long cure times of traditional epoxy adhesives, the "cold bond" cure curves show fixtures in 30 to 60s and complete cures with light in as little as10s.
Charts showing tensile-shear bond strength and viscosity are also included.
Three new 800 Series adhesives cure with activator for interfacial bonding.
All exhibit good gap filling capability and excellent thermal shock resistance; some feature superior adhesion to specific substrates such as plated surfaces and gold.
Four new Multi-Cure 600 light curing adhesives are also available.
These are commonly used for wire tacking, strain relief and seam sealing.
Examples of curing systems appropriate for fast and deep cures of these materials are shown in the selector guide.
The new adhesives cure or fixture in seconds at room temperature, eliminating the need for ovens and waiting for long bake cycles and cool down times.
Fast fixture times also allow for 100% in-line QA testing.
Their thixotropic gel viscosity simplifies dispensing and provides precise control over the amount dispensed.
Low viscosity activators can be easily sprayed or applied with felt pads.
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