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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Intertronics | Subject: Dymax 821-GEL G-20 and G-50
Edited by the Electronicstalk Editorial Team on 25 August 2003

Adhesives keep their distance

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Dymax 821-GEL G-20 and G-50 choke and transformer adhesives contain particles sized to maintain appropriate gaps and simplify the process of bonding gapped e-cores.

Dymax 821-GEL G-20 and G-50 choke and transformer adhesives from Intertronics contain particles sized to maintain appropriate gaps and simplify the process of bonding gapped e-cores The addition of sized particles eliminates the need for manual or automated insertion of spacers, allowing simplification of the manufacturing process

821-GEL G-20 contains particles sized to maintain a 20-micron bond line while the G-50 product contains particles appropriate for a 50-micron bond line.

The adhesives fixture in 15-60s with the appropriate activator when core halves are mated.

Following fixture, rapid strength build-up occurs in minutes at room temperature.

This interfacial or "cold bonding" technique uses a pre-applied activator to cure the adhesive at room temperature.

"Cold bonding" eliminates the need for ovens, cool down time and the additional handling associated with heat cure adhesives.

Costs are reduced by eliminating offline processing steps.

The thixotropic gel viscosity simplifies dispensing and allows precise control over the amount and placement of the adhesive dispensed.

Because of their fast fixturing, excellent durability and shock absorbing properties, Dymax 800 Series "cold bonding" adhesives are used for many ferrite and metal bonding processes.

Other applications include fastening magnets to flux rings for DC motor construction, bonding speaker magnets, and flywheel and alternator construction.

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